Yesterday, the United States University of California at Berkeley outstanding professor Hu Zhengming released "semiconductor miniaturization" scientific and technological achievements. US microelectronics scientists, UC Berkeley distinguished professor Hu Zhengming responsible for the research team, can make two-dimensional semiconductor long vertical fin transistor structure, which means that two-dimensional semiconductor can be used to "cover high-rise" . The team also developed technology that allows two-dimensional semiconductors to grow on large wafers, allowing it to cover vertical thin-film transistors while enabling two, three or more layers of circuitry on a single chip. In addition, a transistor made from a two-dimensional semiconductor film confirms that it allows the triode of a transistor to be reduced to a width of 1 nanometer. Comments Professor Hu Zhengming issued by the ultra-high density chips in the chip material technology, technology have made a major breakthrough, the chip area can be reduced 1000 times. This means that the same area, the number of transistors can be increased thousands of times more than the original, more functional. Although from the current view, there is a certain distance from the product mass production, but once applied in the future, it will certainly give people a huge surprise. - China Internet Association, China Academy of Engineering, Wu He Quan The current semiconductor can be made into a nano-size Q: The current semiconductor miniaturization technology, how small can make the chip? US microelectronics scientist Hu Zhengming, an outstanding professor at the University of California at Berkeley: In the past 12 months, we have found that there is a kind of material that is a two-dimensional semiconductor, which is about as thick as two or three atoms, and can be made with us The combination of three-dimensional transistors, the semiconductor is more miniature. A few months ago, we could make semiconductors one nanometer in size. Q: What difficulties encountered in the development process? Hu Zhengming: About 2010, we encountered a huge bottleneck in the semiconductor miniaturization, when the transistor can no longer be further miniaturized, so can not continue to meet the semiconductor miniaturization process. But then, our research team went through a groundbreaking innovation that turned the usual form of transistor into a three-dimensional transistor, which is like turning a large bungalow in the original city into a building, The area gets together and gets smaller. Increase the number of transistors to speed up the use of hardware Q: What impact will this technology bring to our life and industry? Hu Zhengming: miniaturization technology allows the semiconductor to continue to increase performance, reduce costs. More miniaturized products, the price will be cheaper, more importantly, lower power consumption, faster, cell phone performance can be extended more and more, the user can get all the benefits, and we can expect that these advantages Will continue. For computers, the reason why computers can analyze and process big data is because the number of transistors on the chip increases sharply, the hardware will be used faster and faster, and the speed of the Internet will also be faster. Q: What is the industrialization of this technology? Hu Zhengming: Since 2011, the semiconductor industry has started to use our technology. As for the industrial chain with the latest achievements, I believe it will take place slowly and need to be taken step by step. We have already pointed out this road of industrialization, and how to get through next, we still need every link of effort. Apv Phe Gaskets,Pharmaceutical Phe Gasket For Apv,Apv Phe Gasket,Phe Gasket For Apv Dongguan Runfengda F&M Co., Ltd , https://www.dgrunfengda.com